ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,108, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method to improve interconnect coefficient of therma... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,109, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manufa... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,110, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Octagonal interconnect wiring for advanced l... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,111, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor structures including metal wir... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,112, issued on July 14, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.). "Method of forming copper interconnect struct... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,114, issued on July 14, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Contact pad structure and manufa... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,115, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Growth suppression deposition for CVD tungsten gap f... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,116, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CMPANY LTD. (Hsinchu, Taiwan). "Local interconnect" was invented... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,117, issued on July 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor circuit pattern and manufactu... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,118, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods and systems for filling a gap" was invented by ... और पढ़ें